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The Next Step After Large-Scale Fundraising: New AI-Specialized Product, Low Power and High Speed Semiconductor Chip, to be Released in 2024
In the News
See the Technology
SAKURA Edge AI Co-Processor
ASIC for fast, efficient AI inference acceleration
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MERA Software Framework for AI
Modeling and co-processor core management
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DNA IP Inference Processing Core
Run-time reconfigurable neural network IP
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